and Microwave Laboratory
RF and Microwave Laboratory was established since 1992
in the Department of Electrical Engineering, National Sun Yat-Sen University, Kaohsiung, Taiwan.
Its research focus is to design novel RF/microwave devices, integrated circuits and systems for communications and
sensor applications. The Laboratory has advanced RF/microwave equipments and EDA tools for research.
For near three decades, the Laboratory has produced more than 20 PhD and 100 MS graduates,
and there are now about 20 graduate students pursuing PhD or MS degrees in the Laboratory.
The Laboratory has consistently worked in close partnership with Taiwan industry to establish
the infrastructure for R&D in communications and biomedical technology.
Laboratory consists of three research groups with different
research objectives. They are RF System-on-Chip
(RF-SoC) group, Integrated Passive
Device (IPD) group, and Digitally-assisted
Radio Processing (DRP) group. The research directions
of each group are summarized as follows.
group targets at integrated circuit design of
RF/microwave active components including amplifiers, oscillators,
up/down mixers, modulators, demodulators, and the whole RF transceiver
system with high performance and complete consideration of the
package and board effects. System-in-package is also often realized
as an alternative design solution for RF transceiver system.
focuses on three-dimensional passive components embedded in
a System-in-Package carrier using build-up substrate and integrated
passive device technologies. The components of interest include
inductors, capacitors, transformers, filters, baluns, combiners,
couplers, and antennas with very low loss and miniature size.
group takes up digital signal processing techniques
to benefit radio system with the following advantageous features:
(a) Simplify radio architecture to make it scale down with the
CMOS technology; (b) Break through the performance bottleneck
of analog circuitry in the relation between average efficiency
and dynamic range; (c) Reconfigure the radio system for multi-band
and multi-mode applications.
(RF-SoC) Chip-package codesign of flip-chip and wire-bond packaged
2. (RF-SoC) LC degenerated phase shifter for quadrature modulator/demodulator
3. (IPD) Planar transformer-based integrated passive devices
for wireless communications
4. (IPD) Embedded passive substrate design technology for wireless
5. (DRP) Hybrid quadrature polar modulation technique for high
average-efficiency wireless transmitters
6. (DRP) RF sensing technique for cognitive radio receiver
7. (DRP) Local oscillator pulling effects on wireless communication
1. 50 GHz
four-port vector network analyzer (Agilent E8364B)
2. 8.5 GHz four-port vector network analyzer (Agilent E5071A)
3. 26.5 GHz spectrum analyzer (Agilent 8563E)
4. 3 GHz spectrum analyzer (Agilent 8594E)
5. 10 GHz digital oscilloscope (Agilent DSO810048)
6. 1 GHz digital oscilloscope (Tektronix TDS 680B)
7. 20 GHz signal generator (Agilent 8341B)
8. 1 GHz signal generator (Agilent 8656B)
9. 3 GHz vector signal generator (Agilent E4433B)
10. 3 GHz vector signal analyzer (Agilent 89441)
11. 20 GHz noise figure meter (Agilent 8570B/ 8971C)
12. 26.5 GHz power amplifier (Agilent 83000A)
13. 4.2 GHz power meter (Agilent 437B)
14. 15 MHz arbitrary waveform generator (Agilent 33120A)
15. 80 MHz arbitrary waveform generator (Agilent 33250 A)
16. 50 W power supply (Agilent 6626A)
17. 60 W power supply (Agilent E3646A)
18. Gold wire bonder (Kulicke & Soffa 4522)
19. Aluminum wire bonder (Shin-Mei-Hua SPB-U668)
20. Probe station (Cascade Microtech Summit 9000)