RF & Microwave Lab.
國立中山大學 射頻與微波實驗室

★ Introduction

Laboratory name: RF and Microwave Laboratory

Laboratory briefing:

RF and Microwave Laboratory was established since 1992 in the Department of Electrical Engineering, National Sun Yat-Sen University, Kaohsiung, Taiwan. Its research focus is to design novel RF/microwave devices, integrated circuits and systems for communications and sensor applications. The Laboratory has advanced RF/microwave equipments and EDA tools for research. For near three decades, the Laboratory has produced more than 20 PhD and 100 MS graduates, and there are now about 20 graduate students pursuing PhD or MS degrees in the Laboratory. The Laboratory has consistently worked in close partnership with Taiwan industry to establish the infrastructure for R&D in communications and biomedical technology.

Research targets:

The Laboratory consists of three research groups with different research objectives. They are RF System-on-Chip (RF-SoC) group, Integrated Passive Device (IPD) group, and Digitally-assisted Radio Processing (DRP) group. The research directions of each group are summarized as follows.

  • RF-SoC group targets at integrated circuit design of RF/microwave active components including amplifiers, oscillators, up/down mixers, modulators, demodulators, and the whole RF transceiver system with high performance and complete consideration of the package and board effects. System-in-package is also often realized as an alternative design solution for RF transceiver system.
  • IPD group focuses on three-dimensional passive components embedded in a System-in-Package carrier using build-up substrate and integrated passive device technologies. The components of interest include inductors, capacitors, transformers, filters, baluns, combiners, couplers, and antennas with very low loss and miniature size.
  • DRP group takes up digital signal processing techniques to benefit radio system with the following advantageous features: (a) Simplify radio architecture to make it scale down with the CMOS technology; (b) Break through the performance bottleneck of analog circuitry in the relation between average efficiency and dynamic range; (c) Reconfigure the radio system for multi-band and multi-mode applications.
Recent research achievements:

1. (RF-SoC) Chip-package codesign of flip-chip and wire-bond packaged RFICs
2. (RF-SoC) LC degenerated phase shifter for quadrature modulator/demodulator
3. (IPD) Planar transformer-based integrated passive devices for wireless communications
4. (IPD) Embedded passive substrate design technology for wireless communications
5. (DRP) Hybrid quadrature polar modulation technique for high average-efficiency wireless transmitters
6. (DRP) RF sensing technique for cognitive radio receiver
7. (DRP) Local oscillator pulling effects on wireless communication systems
Major equipments:

1. 50 GHz four-port vector network analyzer (Agilent E8364B)
2. 8.5 GHz four-port vector network analyzer (Agilent E5071A) 
3. 26.5 GHz spectrum analyzer (Agilent 8563E) 
4. 3 GHz spectrum analyzer (Agilent 8594E)
5. 10 GHz digital oscilloscope (Agilent DSO810048)
6. 1 GHz digital oscilloscope (Tektronix TDS 680B) 
7. 20 GHz signal generator (Agilent 8341B) 
8. 1 GHz signal generator (Agilent 8656B)  
9. 3 GHz vector signal generator (Agilent E4433B)
10. 3 GHz vector signal analyzer (Agilent 89441)
11. 20 GHz noise figure meter (Agilent 8570B/ 8971C)
12. 26.5 GHz power amplifier (Agilent 83000A)
13. 4.2 GHz power meter (Agilent 437B)
14. 15 MHz arbitrary waveform generator (Agilent 33120A)
15. 80 MHz arbitrary waveform generator (Agilent 33250 A)
16. 50 W power supply (Agilent 6626A)
17. 60 W power supply (Agilent E3646A)
18. Gold wire bonder (Kulicke & Soffa 4522) 
19. Aluminum wire bonder (Shin-Mei-Hua SPB-U668) 
20. Probe station (Cascade Microtech Summit 9000)